Sub-micron structuring at mesa edges
نویسنده
چکیده
A simple process for forming sub-micron gaps between horizontal and vertical electrodes in a three-dimensional micro-electrode system without the need for high-resolution lithography is described. The process is based on the enhancement of ion milling rates in metals at oblique ion incidence, which allows the preferential erosion of metal at a mesa edge. Self-aligned electrode structures are formed on silica and oxidised silicon mesas, and electrode separations of 150–300 nm are demonstrated in geometries that may be suitable for vertical knife-edge field emission sources. 2004 Elsevier B.V. All rights reserved.
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